Integrated Circuit Packaging Types

• Land Grid Array (LGA)

  • Opposite of a PGA i.e. Pins protrude from the motherboard, and the IC has pin holes
  • Pros
    • Not prone to damage

• Pin Grid Array (PGA)

  • Use pins to make connections
  • Types
    • Ceramic PGA (CPGA)
    • Plastic PGA (PPGA)
    • Staggered PGA (SPGA)
    • Flip-Chip PGA (FCPGA)

• Ball Grid Array (BGA)

  • Use solder balls to make connections
  • Pros
    • Can be reballed
    • Easy to desolder
  • Cons
    • Hard to repair, because solder joints can only be checked by X-Rays
    • Only usable in multi-layer PCBs

• Ceramic Column Grid Arrays (CCGA)

  • Used in military and space applications due to extreme reliability
  • Not used in consumer applications due to restrictions by RoHS in the EU

• System-in-Package (SiP) / 3D IC (stacked)

• Package-on-Package (PoP)

• Multi Chip Module (MCM)

• Network on a Chip

NOTE: JEDEC sets standards for packaging formats

• Through Hole Technology
• Surface Mount Technology
  • e.g. BGA